- Patent Title: Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, vapor deposition pattern forming method, and method for producing organic semiconductor element
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Application No.: US16494802Application Date: 2018-03-30
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Publication No.: US10895008B2Publication Date: 2021-01-19
- Inventor: Yasuko Sone , Hiroshi Kawasaki , Yoshinori Hirobe , Katsunari Obata , Asako Narita , Hitoshi Ishiro , Chiaki Hatsuta
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr & Brown, PLLC
- Priority: JP2017-072211 20170331,JP2017-072212 20170331
- International Application: PCT/JP2018/013798 WO 20180330
- International Announcement: WO2018/181969 WO 20181004
- Main IPC: C23C16/04
- IPC: C23C16/04 ; C23C14/04 ; H01L51/00 ; H01L51/56
Abstract:
A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 μm.
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