Invention Grant
- Patent Title: Electronic component handler and electronic component tester
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Application No.: US16177588Application Date: 2018-11-01
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Publication No.: US10895595B2Publication Date: 2021-01-19
- Inventor: Takahito Sanekata
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hamess, Dickey & Pierce, P.L.C.
- Priority: JP2017-212511 20171102
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01R31/28 ; G06T7/521 ; H05K3/00

Abstract:
An electronic component handler includes: a placing plate on which an electronic component can be placed; a camera which picks up an image of the placing plate; a light source of a laser beam which casts the laser beam on the placing plate; and a processor for determining whether the electronic component is placed on the placing plate or not and which controls working of the camera and the light source of the laser beam when the processor carries out determination. When determining whether the electronic component is placed on the placing plate or not, the processor causes the camera to pick up an image of the placing plate in a state where the light source of the laser beam is casting the laser beam on the placing plate, and determines whether the electronic component is placed or not, based on a boundary of luminance in the image.
Public/Granted literature
- US20190128957A1 ELECTRONIC COMPONENT HANDLER AND ELECTRONIC COMPONENT TESTER Public/Granted day:2019-05-02
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