A method, and apparatus provided thereby, includes providing a substrate and placing an integrated laser on the substrate. A first cladding layer surrounds the integrated laser and includes a laser optical coupler aligned with an output of the laser. The laser optical coupler includes silicon and the laser includes a III-V compound semiconductor. The output of the laser is spaced apart from the laser optical coupler by a gap of less than or equal to 500 nanometers. An optical waveguide is positioned on the first cladding layer and in optical communication with the laser optical coupler.