Invention Grant
- Patent Title: Main board and computer apparatus with connectors of both dual in-line package and surface mount technology
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Application No.: US16008038Application Date: 2018-06-14
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Publication No.: US10896698B2Publication Date: 2021-01-19
- Inventor: Yao-Chung Chang , Wen-Jui Hsu
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW107203996U 20180328
- Main IPC: G11C5/04
- IPC: G11C5/04 ; G11C7/10 ; H05K1/18
Abstract:
A main board and a computer apparatus having the main board are provided. The main board includes a printed circuit board (PCB), a first connector, and a second connector. The PCB is configured for being electrically connected to a processor. The first connector is electrically connected to the PCB in a dual in-line package (DIP) manner, and is configured for a memory to be mounted to the first connector. The second connector is electrically connected to the PCB in a surface mount technology (SMT) manner, and is configured for the memory to be mounted to the second connector. Accordingly, transmission performance of memory signals may be improved.
Public/Granted literature
- US20190304513A1 MAIN BOARD AND COMPUTER APPARATUS Public/Granted day:2019-10-03
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