An apparatus that separates a resin layer together with a film from a wafer to which the film is made to adhere with the intermediary of the resin layer formed on one surface and around which a protruding part is formed through protrusion of the film from a peripheral edge includes a separating unit that separates the resin layer from the one surface of the wafer. An imaging unit images the one surface from which the resin layer has been separated. A first determining part determines whether or not a resin residual in one pixel of a captured image exists based on the brightness of the one pixel, and a second determining part determines whether or not a resin residual that adversely affects grinding exists from the captured image after the first determining part has determined whether or not a resin residual exists in each pixel.