Invention Grant
- Patent Title: Tape heating methods
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Application No.: US16136021Application Date: 2018-09-19
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Publication No.: US10896840B2Publication Date: 2021-01-19
- Inventor: Michael J. Seddon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, LTD.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/67
Abstract:
Implementations of a method of increasing the adhesion of a tape. Implementations may include: mounting a tape to a frame, mounting a substrate to the tape, heating the tape after mounting the substrate at one or more temperatures for a predetermined period of time, and increasing an adhesion of the tape to the substrate through heating the tape.
Public/Granted literature
- US20200090974A1 TAPE HEATING METHODS Public/Granted day:2020-03-19
Information query
IPC分类:
