Invention Grant
- Patent Title: Electronic device and connector
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Application No.: US16466619Application Date: 2017-02-20
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Publication No.: US10896868B2Publication Date: 2021-01-19
- Inventor: Soichiro Umeda , Yuji Morinaga
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/006026 WO 20170220
- International Announcement: WO2018/150556 WO 20180823
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/495 ; H01L21/48

Abstract:
An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.
Public/Granted literature
- US20190318982A1 ELECTRONIC DEVICE AND CONNECTOR Public/Granted day:2019-10-17
Information query
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