Invention Grant
- Patent Title: Semiconductor device including a functional layer and a method of fabricating the same
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Application No.: US16401347Application Date: 2019-05-02
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Publication No.: US10896955B2Publication Date: 2021-01-19
- Inventor: Kangmook Lim , Sang Su Kim , Woo Seok Park , Sung Gi Hur
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0130032 20181029
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L29/06 ; H01L21/8238 ; H01L29/423 ; H01L29/786 ; H01L21/762 ; H01L29/66 ; H01L21/02 ; H01L27/092 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, an active region disposed on the substrate and extending in a first direction, a device isolation layer adjacent to the active region, a gate structure disposed in the active region, the gate structure extending in a second direction crossing the first direction, and covering a portion of the device isolation layer, a gate separation pattern contacting an end of the gate structure, and an impurity region disposed below the gate separation pattern and on the device isolation layer.
Information query
IPC分类: