Invention Grant
- Patent Title: Oxide semiconductor device and method for manufacturing same
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Application No.: US16343022Application Date: 2017-09-04
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Publication No.: US10896978B2Publication Date: 2021-01-19
- Inventor: Tetsuya Goto , Michinobu Mizumura
- Applicant: V TECHNOLOGY CO., LTD. , TOHOKU UNIVERSITY
- Applicant Address: JP Kanagawa; JP Miyagi
- Assignee: V TECHNOLOGY CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee: V TECHNOLOGY CO., LTD.,TOHOKU UNIVERSITY
- Current Assignee Address: JP Kanagawa; JP Miyagi
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP2016-206647 20161021
- International Application: PCT/JP2017/031817 WO 20170904
- International Announcement: WO2018/074083 WO 20180426
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/425 ; H01L29/66

Abstract:
In an oxide semiconductor device including an active layer region constituted by an oxide semiconductor, stability when a stress is applied is improved. The oxide semiconductor device includes an active layer region constituted by an oxide semiconductor of indium (In), gallium (Ga), and zinc (Zn), wherein the active layer region contains an element selected from titanium (Ti), zirconium (Zr), and hafnium (Hf) that are Group 4 elements, or carbon (C), silicon (Si), germanium (Ge), and tin (Sn) that are Group 14 elements at a number density in a range of 1×1016 to 1×1020 cm−3.
Public/Granted literature
- US20190288115A1 OXIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-09-19
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