Invention Grant
- Patent Title: Laminated ceramic electronic component and electronic component assembly
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Application No.: US16502213Application Date: 2019-07-03
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Publication No.: US10897003B2Publication Date: 2021-01-19
- Inventor: Masayuki Uetani
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2018-130839 20180710
- Main IPC: G11C11/00
- IPC: G11C11/00 ; H01L41/047 ; G11B21/21 ; H01L41/09 ; H01L41/083

Abstract:
An opposite-side dielectric ceramic layer is in contact with a first opposite-surface electrode layer and a second opposite-surface electrode layer. A mounting-side dielectric ceramic layer is in contact with a first mounting-surface electrode layer and a second mounting-surface electrode layer. A mounting-side inner electrode layer is separated from the first mounting-surface electrode layer and the second mounting-surface electrode layer by the mounting-side dielectric ceramic layer, disposed on the mounting-side dielectric ceramic layer, extending from a first side-surface electrode layer, and separated from a second side-surface electrode layer. In a cross-sectional view including a lamination direction and a length direction, a position in which the second mounting-surface electrode layer has a maximum thickness is shifted toward a second side surface in the length direction with respect to a position in which the second opposite-surface electrode layer has a maximum thickness.
Public/Granted literature
- US20200020844A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY Public/Granted day:2020-01-16
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