Invention Grant
- Patent Title: Cooling system for high density heat loads
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Application No.: US16405502Application Date: 2019-05-07
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Publication No.: US10897838B2Publication Date: 2021-01-19
- Inventor: Thomas Harvey , Stephen Sillato
- Applicant: Vertiv Corporation
- Applicant Address: US OH Columbus
- Assignee: Vertiv Corporation
- Current Assignee: Vertiv Corporation
- Current Assignee Address: US OH Columbus
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling system including a primary cooling module supplying refrigerant to a circuit including a thermal load. A secondary cooling module provides a supplemental flow of refrigerant to the circuit upon detection of a deficiency of the primary cooling module. A valve is disposed between the primary: module and the circuit to prevent refrigerant flow between the primary cooling module in the circuit. The secondary cooling module transactions from a standby mode of operation to an online mode of operation and the primary cooling module is deactivated in response to detection of the deficiency of the primary cooling module.
Public/Granted literature
- US20190269043A1 Cooling System for High Density Heat Loads Public/Granted day:2019-08-29
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