- Patent Title: Systems and methods for analysis of material properties of components and structures using machining processes to enable stress relief in the material under test
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Application No.: US16201994Application Date: 2018-11-27
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Publication No.: US10900768B2Publication Date: 2021-01-26
- Inventor: Adrian T. DeWald , Michael R. Hill , Eric Summer , Brett Watanabe , Teresa Wong
- Applicant: Hill Engineering, LLC
- Applicant Address: US CA Rancho Cordova
- Assignee: Hill Engineering, LLC
- Current Assignee: Hill Engineering, LLC
- Current Assignee Address: US CA Rancho Cordova
- Agent Kang S. Lim
- Main IPC: G01B7/16
- IPC: G01B7/16 ; G01N3/00 ; G01L1/00

Abstract:
Analysis of residual stress in materials is often done in static conditions in a laboratory. Accurate systems and methods for performing these analyses in a dynamic, non-laboratory environment are notoriously difficult and can be very inaccurate. A method using a portable, field deployable apparatus having greater accuracy than currently available is disclosed whereby accurate and repeatable residual stress analysis may be implemented in non-laboratory environments leading to greatly improved diagnostics, maintenance and life limit prediction.
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