Invention Grant
- Patent Title: Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly
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Application No.: US16085737Application Date: 2017-03-09
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Publication No.: US10900855B2Publication Date: 2021-01-26
- Inventor: Hyuk Hwi Na , Ho Seok Hwang , Ja Guen Gu , Dong Hee Lee , Hyang Won Kang , Hyung Jin Lim , Yeong Seol Kwon
- Applicant: ITM SEMICONDUCTOR CO., LTD.
- Applicant Address: KR Chungcheongbuk-do
- Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer
- Priority: KR10-2016-0034720 20160323
- International Application: PCT/KR2017/002566 WO 20170309
- International Announcement: WO2017/164549 WO 20170928
- Main IPC: G01L13/06
- IPC: G01L13/06 ; G01L17/00 ; G01L5/10 ; G01L19/06 ; G01D11/24 ; G01L19/14

Abstract:
Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.
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