Invention Grant
- Patent Title: RF sensing apparatus of plasma processing chamber and plasma processing chamber including same
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Application No.: US16261175Application Date: 2019-01-29
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Publication No.: US10901007B2Publication Date: 2021-01-26
- Inventor: Young Do Kim , Sung Yong Lim , Chan Soo Kang , Do Hoon Kwon , Min Ju Kim , Sang Ki Nam , Jung Mo Yang , Jong Hun Pi , Kyu Hee Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2018-0101556 20180828
- Main IPC: G01R15/18
- IPC: G01R15/18 ; H05H1/46 ; H01F27/28 ; G01R15/16

Abstract:
An RF sensing apparatus configured for use with a plasma processing chamber includes a penetration unit opened in an up/down direction, a main return path unit surrounding all or a portion of the penetration unit, and a secondary return path unit located between the penetration unit and the main return path unit, spaced apart from the main return path unit, and surrounding all or a portion of the penetration unit. The main return path unit and the secondary return path unit include a path through which a current flows in one of the up/down directions.
Public/Granted literature
- US20200072874A1 RF SENSING APPARATUS OF PLASMA PROCESSING CHAMBER AND PLASMA PROCESSING CHAMBER INCLUDING SAME Public/Granted day:2020-03-05
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