Invention Grant
- Patent Title: Electric connecting apparatus
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Application No.: US16320818Application Date: 2017-07-18
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Publication No.: US10901031B2Publication Date: 2021-01-26
- Inventor: Masatomo Uebayashi , Akihisa Akahira , Tomoaki Kuga
- Applicant: Kabushiki Kaisha Nihon Micronics
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Tokyo
- Agency: Lorenz & Kopf, LLP
- Priority: JP2016-147102 20160727
- International Application: PCT/JP2017/025891 WO 20170718
- International Announcement: WO2018/021088 WO 20180201
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/073 ; G01R31/26

Abstract:
Provided is an electric connecting apparatus 10 including a plurality of probes 20, a probe substrate 16 connected to base end portions 20b of the probes 20, and a probe support body 18, when tip end portions 20a of the probes 20 are pressed by a device under test, preventing the adjacent probes 20 from interfering. The probe support body 18 includes a plate-like guide portion 30 including guide holes through which the probes 20 pass. The guide portion 30 includes an upper guide portion 31, a lower guide portion 32, and a middle guide portion 33. The probes pass through the guide holes of the upper guide portion 31, the middle guide portion 33, and the lower guide portion 32 to be guided toward the device under test. The middle guide portion 33 is provided to be movable in a perpendicular direction X perpendicular to a thickness direction Y.
Public/Granted literature
- US20190170817A1 ELECTRIC CONNECTING APPARATUS Public/Granted day:2019-06-06
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