A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked and coupled through a unidirectional through electrode and a plurality of bidirectional through electrodes, wherein a through electrode in which a failure has occurred among the unidirectional through electrode and the plurality of bidirectional through electrodes is replaced based on a plurality of transfer control signals. The plurality of transfer control signals including failure information on the unidirectional through electrode and the plurality of bidirectional through electrodes.