Invention Grant
- Patent Title: Virtualized physical layer adapted for EHF contactless communication
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Application No.: US16520771Application Date: 2019-07-24
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Publication No.: US10903875B2Publication Date: 2021-01-26
- Inventor: Gary D. McCormack , Ian A. Kyles , Roger D. Isaac
- Applicant: Keyssa, Inc.
- Applicant Address: US CA Campbell
- Assignee: Keyssa, Inc.
- Current Assignee: Keyssa, Inc.
- Current Assignee Address: US CA Campbell
- Agency: Van Court & Aldridge LLP
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H04W76/10 ; H04W76/14

Abstract:
A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.
Public/Granted literature
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