A connecting arrangement includes an electronic component and a printed circuit board, and a method includes establishing a solder connection between the component and circuit board. The component has a housing with a support area, and a contact element with a first contact area running parallel to the support area of the housing, a second contact area at a prespecified angle relative to the first contact area, and a rounded transition region formed between the first and second contact areas. The circuit board has a first surface with a soldering area including a constriction, a first section, and a second section connected to the first section via the constriction. The transition region is in a region of the constriction. The second contact area is connected to the second section via a solder connection. The support area is at an angle relative to the first surface corresponding to the prespecified angle.