Invention Grant
- Patent Title: Polishing pad and method for making the same
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Application No.: US15879841Application Date: 2018-01-25
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Publication No.: US10906154B2Publication Date: 2021-02-02
- Inventor: Chung-Chih Feng , I-Peng Yao , Chih-Yi Lin , Tai-Yun Fu , Yung-Chang Hung , Jhih-Gong Lin
- Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Applicant Address: TW Kaohsiung
- Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Priority: TW103139819A 20141117
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/22 ; B24D18/00 ; B24D3/28

Abstract:
The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.
Public/Granted literature
- US20180147690A1 POLISHING PAD AND METHOD FOR MAKING THE SAME Public/Granted day:2018-05-31
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