Invention Grant
- Patent Title: Three-dimensional shaping device
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Application No.: US16856130Application Date: 2020-04-23
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Publication No.: US10906242B2Publication Date: 2021-02-02
- Inventor: Kenta Anegawa , Kohei Yuwaki , Yusuke Watanabe
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2019-082907 20190424
- Main IPC: B29C64/209
- IPC: B29C64/209 ; B29C64/393 ; B33Y50/02 ; B33Y30/00

Abstract:
Provided is a three-dimensional shaping device including a melting unit configured to melt a material into a shaping material, and a nozzle configured to discharge the shaping material supplied from the melting unit toward a stage. The melting unit includes a screw configured to rotate about a rotation axis and having a groove forming surface in which a groove to which the material is supplied is formed, a heating unit configured to heat the material supplied to the groove, a barrel having a facing surface that faces the groove forming surface and provided with a communication hole that communicates the facing surface with the nozzle, and a discharge amount adjustment mechanism provided in the communication hole and configured to adjust a flow rate of the shaping material discharged from the nozzle.
Public/Granted literature
- US20200338821A1 Three-Dimensional Shaping Device Public/Granted day:2020-10-29
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