Invention Grant
- Patent Title: Semiconductor element, recording element substrate, and liquid discharge head
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Application No.: US16452336Application Date: 2019-06-25
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Publication No.: US10906304B2Publication Date: 2021-02-02
- Inventor: Masaya Uyama , Takuya Hatsui , Souta Takeuchi , Masataka Kato , Toru Nakakubo , Tomohiro Takahashi
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2018-125042 20180629,JP2019-096199 20190522
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H01L23/00
Abstract:
A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.
Public/Granted literature
- US20200001605A1 SEMICONDUCTOR ELEMENT, RECORDING ELEMENT SUBSTRATE, AND LIQUID DISCHARGE HEAD Public/Granted day:2020-01-02
Information query
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