The present invention concerns a method for making a microsatellite, comprising providing: modules of a first type configured to house electronic boards of a microsatellite; modules of a second type configured to house devices and systems of a microsatellite; and modules of a third type comprising first and second interface means configured to be coupled to a launch vehicle and to external appendages of a microsatellite, respectively; said modules of a third type being designed to cause a body of a microsatellite to have a predefined height; wherein all the modules of the first, second and third types are configured to be stacked regardless of the type. The method further comprises making a body of a microsatellite by stacking modules of different types, wherein the stacked modules include at least one module of the second type and at least one module of the third type.