A method for inhibiting whisker growth on a metallic substrate susceptible to whisker growth (e.g., tin, zinc, cadmium, indium, silver, lead, aluminum, gold, aluminum, gold, and alloys thereof), the method comprising coating a surface of the metallic substrate with a charge dissipative (CD) polymer, or more particularly, an electrostatically dissipative (ESD) polymer, that inhibits whisker growth on said surface under conditions where whisker growth would otherwise occur. In some embodiments, the CD or ESD polymer does not possess the necessary strength and/or thickness to function as a physical barrier for whisker growth. In particular embodiments, the CD or ESD polymer prevents the onset of whisker formation or growth, thus not requiring the CD or ESD polymer to function as a physical barrier.