A low viscosity energy curable epoxy resin composition essentially free of solvent for preparing an ink composition comprising: (a) at least one divinylarene dioxide compound, (b) at least one cycloaliphatic epoxy resin, (c) at least one vinyl ether compound, (d) at least one cationic photoinitiator, (e) at least one pigment, and (f) optionally, at least one oxetane; wherein (i) the viscosity of the curable composition is less than or equal to about 50 mPa·s at 25° C., (ii) the composition cures at a relative humidity of greater than 30%, and (iii) the composition cures with an increase in cure time of less than 100% when the composition is cured at a relative humidity of at least 70% compared to that of a composition that is cured at a relative humidity of less than or equal to 45%. The curable epoxy resin composition is useful, for example, for preparing an ink composition; and more specifically for preparing a solventless low viscosity UV curable inkjet ink composition.