Invention Grant
- Patent Title: Semiconductor module including semiconductor package and semiconductor package
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Application No.: US15715625Application Date: 2017-09-26
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Publication No.: US10908209B2Publication Date: 2021-02-02
- Inventor: Seyoung Won , Dan-Kyu Kang , Sang-Yeol Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0124747 20160928
- Main IPC: G01T1/08
- IPC: G01T1/08 ; G01R31/28 ; H01L23/00 ; G01T1/16 ; G01K11/12 ; G01K1/02 ; G01N21/78 ; G01R31/44 ; G01N21/77 ; G01N21/81 ; H01L25/065
Abstract:
A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
Public/Granted literature
- US20180088173A1 SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE Public/Granted day:2018-03-29
Information query
