Invention Grant
- Patent Title: Film, film forming method, solid image pickup element, and infrared sensor
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Application No.: US15785925Application Date: 2017-10-17
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Publication No.: US10908335B2Publication Date: 2021-02-02
- Inventor: Kazuya Oota , Kyohei Arayama , Masahiro Mori
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-094218 20150501
- Main IPC: G02B5/22
- IPC: G02B5/22

Abstract:
A film has a maximum light transmittance value of 20% or lower in a wavelength range of 450 to 650 nm in a film thickness direction, a light transmittance of 20% or lower at a wavelength of 835 nm in the film thickness direction, and a minimum light transmittance value of 70% or higher in a wavelength range of 1000 to 1300 nm in the film thickness direction. A method of forming the film includes forming a first spectrally selective layer and forming a second spectrally selective layer. A kit for forming the film includes a first composition and a second composition.
Public/Granted literature
- US20180039171A1 FILM, FILM FORMING METHOD, SOLID IMAGE PICKUP ELEMENT, AND INFRARED SENSOR Public/Granted day:2018-02-08
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