Invention Grant
- Patent Title: Photolithography process and photolithography apparatus
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Application No.: US16101631Application Date: 2018-08-13
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Publication No.: US10908495B2Publication Date: 2021-02-02
- Inventor: Yao Jun Du , Liang Li , Juan Liu
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201710734995 20170824
- Main IPC: G03F1/36
- IPC: G03F1/36 ; G03F1/44 ; G03F1/26 ; G03F7/20

Abstract:
A photolithography process includes providing a first test layout including test patterns, and a first light source; forming an initial mask layout according to the first test layout; forming a mask layout including mask layout patterns through an optical proximity correction or a phase-shifting masking; forming exposed patterns by exposing the mask layout using the first light source; and determining a weak region from the first test layout. A first distance between adjacent test patterns in the weak region is unequal to a second distance between corresponding exposed patterns. The photolithography process further includes performing a re-layout on the weak region to increase the first distance, thereby providing an adjusted test layout; performing a light-source optimization to obtain an adjusted light source; and determining the adjusted test layout and the adjusted light source as a second test layout and a second light source, respectively when process window requirements are satisfied.
Public/Granted literature
- US20190064655A1 PHOTOLITHOGRAPHY PROCESS AND PHOTOLITHOGRAPHY APPARATUS Public/Granted day:2019-02-28
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