Invention Grant
- Patent Title: Resist composition, method of forming resist pattern, polymeric compound, and compound
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Application No.: US16148315Application Date: 2018-10-01
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Publication No.: US10908502B2Publication Date: 2021-02-02
- Inventor: Masatoshi Arai , Takuya Ikeda , Koshi Onishi
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: JP2017-195388 20171005
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/16 ; C08F220/38 ; C07D409/04 ; C07D307/42 ; C07D333/22 ; C08F220/28 ; G03F7/20 ; G03F7/38 ; G03F7/32 ; G03F7/039 ; C08F220/22

Abstract:
A resist composition including a resin component having a structural unit derived from a compound represented by formula (a0-1), in which W represents a polymerizable group-containing group; Ra01 represents an alkyl group or an aromatic heterocyclic group containing an oxygen atom or a sulfur atom; in the case where Ra01 is an aromatic heterocyclic group containing an oxygen atom or a sulfur atom, Ra02 is a group which forms an aliphatic cyclic group containing an electron-withdrawing group, together with the tertiary carbon atom (*C) to which Ra01 is bonded; and when Ra01 is an alkyl group, Ra02 is a group in which an aliphatic cyclic group containing an electron-withdrawing group forms a condensed ring together with an aromatic heterocyclic group containing an oxygen atom or a sulfur atom.
Public/Granted literature
- US20190107779A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND Public/Granted day:2019-04-11
Information query
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