Invention Grant
- Patent Title: Photoresist developer composition and manufacturing method of semiconductor package using the same
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Application No.: US16101883Application Date: 2018-08-13
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Publication No.: US10908505B2Publication Date: 2021-02-02
- Inventor: Sang Hyun Kwon , Jin Hee Hwang , Seong Chan Park , Young Ju Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0000412 20180102
- Main IPC: G03F7/32
- IPC: G03F7/32
Abstract:
A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.
Public/Granted literature
- US20190204746A1 PHOTORESIST DEVELOPER COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2019-07-04
Information query
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