Invention Grant
- Patent Title: Electronic device housing
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Application No.: US15760735Application Date: 2016-09-06
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Publication No.: US10908651B2Publication Date: 2021-02-02
- Inventor: Masato Honma , Yoshiki Takebe , Naokichi Imai , Takashi Fujioka
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-185785 20150918,JP2015-185786 20150918,JP2015-185787 20150918
- International Application: PCT/JP2016/076117 WO 20160906
- International Announcement: WO2017/047440 WO 20170323
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20
Abstract:
An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
Public/Granted literature
- US20180260003A1 ELECTRONIC DEVICE HOUSING Public/Granted day:2018-09-13
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