Invention Grant
- Patent Title: Determining thermal margins in a multi-die processor
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Application No.: US16353083Application Date: 2019-03-14
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Publication No.: US10908660B2Publication Date: 2021-02-02
- Inventor: Sandeep Ahuja , Jeremy Ridge , Michael Berktold
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F1/20 ; G06F1/3203 ; G06F1/324 ; G06F1/3296 ; G06F1/3234 ; G01K3/08

Abstract:
In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.
Public/Granted literature
- US20190204885A1 Determining Thermal Margins In A Multi-Die Processor Public/Granted day:2019-07-04
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