Invention Grant
- Patent Title: Touchpad module
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Application No.: US16663322Application Date: 2019-10-24
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Publication No.: US10908692B2Publication Date: 2021-02-02
- Inventor: Takashi Mori
- Applicant: NIDEC COPAL CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIDEC COPAL CORPORATION
- Current Assignee: NIDEC COPAL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2018-200772 20181025
- Main IPC: G06F3/0354
- IPC: G06F3/0354 ; G06F3/01 ; H02K33/18

Abstract:
A touchpad module includes a movable plate in which one surface is an operation surface of a touchpad, a support member including a facing portion facing the other surface of the movable plate, damper members for connecting the movable plate and the support member, and an actuator for vibrating the movable plate. The actuator includes an air-core coil and a magnet facing each other in a first direction in which the other surface faces the facing portion. The air-core coil is fixed to the other surface, and the magnet is fixed to the facing portion. The actuator vibrates the movable plate in a second direction perpendicular to the first direction by energizing the air-core coil.
Information query
IPC分类: