Invention Grant
- Patent Title: Dynamic semiconductor memory device and memory system with temperature sensor
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Application No.: US16418201Application Date: 2019-05-21
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Publication No.: US10910035B2Publication Date: 2021-02-02
- Inventor: Chui Hwan Choo , Kwang Hyun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A
- Priority: KR10-2018-0153800 20181203
- Main IPC: G11C11/406
- IPC: G11C11/406 ; G11C11/4091 ; G11C11/4074 ; G11C11/4096 ; G11C11/4094 ; G11C11/4099 ; G11C11/408 ; G11C8/12

Abstract:
Provided are a dynamic semiconductor memory device and a memory system including the same. The dynamic semiconductor memory device includes a memory cell array including a first memory cell array block including a plurality of first dynamic memory cells connected between a plurality of first word lines and a plurality of first bit lines, a second memory cell array block including a plurality of second dynamic memory cells connected between a plurality of second word lines and a plurality of second bit lines, and a sense amplification block including a plurality of sense amplifiers configured to amplify voltages of the plurality of first bit lines and voltages of the plurality of second bit lines to a first sensing supply voltage or at least one second sensing voltage higher than the first sensing supply voltage; a temperature sensor unit configured to sense a temperature and generate a temperature sensing signal; and a voltage generator configured to generate the first sensing supply voltage or the at least one second sensing supply voltage in response to the temperature sensing signal and to apply the first sensing supply voltage or the at least one second sensing supply voltage to the memory cell array and to apply a sensing ground voltage to the memory cell array.
Public/Granted literature
- US20200176052A1 DYNAMIC SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME Public/Granted day:2020-06-04
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