Substrate treating apparatus and substrate treating method
Abstract:
A control device is provided which, at a time of upper surface treatment for treating an upper surface of a substrate with a treating device, supplies a treating liquid from a treating liquid supply source and operates a first control valve to supply a gas at a first flow rate from a gas nozzle, while operating a rotary drive device to spin the substrate at a first rotational frequency, and at a time of drying treatment, after completion of the upper surface treatment, for drying the substrate by increasing the rotational frequency of the rotary drive device to spin the substrate at a second rotational frequency, operates the first control valve and second control valve to supply the gas at a higher flow rate than the first flow rate from the gas nozzle.
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