Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
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Application No.: US15962416Application Date: 2018-04-25
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Publication No.: US10910235B2Publication Date: 2021-02-02
- Inventor: Kazuki Nakamura , Katsunori Tanaka , Masahiro Nonomura
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2017-088214 20170427
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
A control device is provided which, at a time of upper surface treatment for treating an upper surface of a substrate with a treating device, supplies a treating liquid from a treating liquid supply source and operates a first control valve to supply a gas at a first flow rate from a gas nozzle, while operating a rotary drive device to spin the substrate at a first rotational frequency, and at a time of drying treatment, after completion of the upper surface treatment, for drying the substrate by increasing the rotational frequency of the rotary drive device to spin the substrate at a second rotational frequency, operates the first control valve and second control valve to supply the gas at a higher flow rate than the first flow rate from the gas nozzle.
Public/Granted literature
- US20180315624A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2018-11-01
Information query
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