Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16172911Application Date: 2018-10-29
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Publication No.: US10910245B2Publication Date: 2021-02-02
- Inventor: Takahiro Yamaguchi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JP2017-220076 20171115
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66
Abstract:
A substrate processing method includes a substrate rotating step of rotating a substrate in a horizontal posture, a processing liquid supplying step of supplying a processing liquid to an upper surface of the substrate which is being rotated in the substrate rotating step, a liquid film state monitoring step of monitoring a state of a liquid film formed on the upper surface of the substrate by the processing liquid supplied to the upper surface of the substrate, and a substrate rotational speed changing step of changing rotational speed of the substrate in accordance with the state of the liquid film monitored in the liquid film state monitoring step during execution of the processing liquid supplying step.
Public/Granted literature
- US20190148192A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-05-16
Information query
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