Invention Grant
- Patent Title: Systems and methods for automated wafer handling
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Application No.: US16186936Application Date: 2018-11-12
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Publication No.: US10910249B2Publication Date: 2021-02-02
- Inventor: Feng-Lung Hsieh , Kuo-Hsiang Huang , Hung-Jen Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; B25J9/16 ; H01L21/67 ; B65G1/137

Abstract:
In an embodiment a system includes: a wafer store comprising a wafer configured for processing by a semiconductor processing tool; a cart configured to transport the wafer from the wafer store along a predetermined path; a robotic arm, the robotic arm configured to: read wafer data from the wafer store, transport the wafer from the wafer store to the cart, send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.
Public/Granted literature
- US20190148198A1 SYSTEMS AND METHODS FOR AUTOMATED WAFER HANDLING Public/Granted day:2019-05-16
Information query
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