A substrate processing apparatus includes a processing container; a placement table; a plurality of pins provided on the placement table configured to perform delivery of the substrate; a plurality of drivers configured to vertically drive the plurality of pins, respectively; a plurality of measuring devices each including an encoder configured to measure height positions of the plurality of pins, respectively. The substrate processing apparatus also includes a controller configured to: measure the height positions of the plurality of pins; select a reference pin; estimate a reference height position; calculate an adjustment speed for making the height positions of the pins other than the reference pin match with the estimated reference height position; and control the drivers, which drive the other pins, to adjust driving speeds of the other pins to an adjustment speed.