Invention Grant
- Patent Title: Engineered substrate structure and method of manufacture
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Application No.: US16673710Application Date: 2019-11-04
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Publication No.: US10910258B2Publication Date: 2021-02-02
- Inventor: Vladimir Odnoblyudov , Cem Basceri , Shari Farrens
- Applicant: QROMIS, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: QROMIS, Inc.
- Current Assignee: QROMIS, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/48 ; H01L21/02 ; H01L21/311 ; H01L29/06 ; B32B9/00
Abstract:
A substrate includes a polycrystalline ceramic core; a first adhesion layer encapsulating the polycrystalline ceramic core; a conductive layer encapsulating the first adhesion layer; a second adhesion layer encapsulating the conductive layer; a barrier layer encapsulating the second adhesion layer, and a bonding layer coupled to the barrier layer, and a substantially single crystalline silicon layer coupled to the bonding layer.
Public/Granted literature
- US20200066574A1 ENGINEERED SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURE Public/Granted day:2020-02-27
Information query
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