Invention Grant
- Patent Title: Wafer processing method
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Application No.: US16453503Application Date: 2019-06-26
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Publication No.: US10910269B2Publication Date: 2021-02-02
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2018-129267 20180706
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/364 ; B23K26/40 ; H01L21/304 ; C09J7/25 ; H01L21/683
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.
Public/Granted literature
- US20200013676A1 WAFER PROCESSING METHOD Public/Granted day:2020-01-09
Information query
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