Invention Grant
- Patent Title: Package structure with TFTS and die covered RDL
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Application No.: US15943736Application Date: 2018-04-03
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Publication No.: US10910285B2Publication Date: 2021-02-02
- Inventor: Yi-Hung Lin , Chien-Chang Lu , Cheng-I Wu , Li-Wei Sung , Cheng-Chi Wang , Chin-Lung Ting
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Priority: CN201711241412 20171130
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L27/02 ; H01L25/065 ; H01L27/12
Abstract:
The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.
Public/Granted literature
- US20180323126A1 PACKAGE STRUCTURE Public/Granted day:2018-11-08
Information query
IPC分类:
