Invention Grant
- Patent Title: Electronic device and connection body
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Application No.: US16470953Application Date: 2017-02-20
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Publication No.: US10910292B2Publication Date: 2021-02-02
- Inventor: Soichiro Umeda , Yuji Morinaga
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/006028 WO 20170220
- International Announcement: WO2018/150557 WO 20180823
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L23/482 ; H01L23/31

Abstract:
An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90 and a connection body 50 having a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75. The head part 40 has a second projection protruding 42 toward the electronic element 95 and a first projection 41 protruding from the second projection 42 toward the electronic element 95.
Information query
IPC分类: