Invention Grant
- Patent Title: Lead frame and method of fabricating the same
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Application No.: US16991198Application Date: 2020-08-12
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Publication No.: US10910296B2Publication Date: 2021-02-02
- Inventor: Holger Beer , Lars Paulsen
- Applicant: Danfoss Silicon Power GmbH
- Applicant Address: DE Flensburg
- Assignee: Danfoss Silicon Power GmbH
- Current Assignee: Danfoss Silicon Power GmbH
- Current Assignee Address: DE Flensburg
- Agency: McCormick, Paulding & Huber PLLC
- Priority: DE102016112289 20160705
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00

Abstract:
A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.
Public/Granted literature
- US20200373229A1 LEAD FRAME AND METHOD OF FABRICATING THE SAME Public/Granted day:2020-11-26
Information query
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