Invention Grant
- Patent Title: Dual thickness fuse structures
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Application No.: US15975041Application Date: 2018-05-09
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Publication No.: US10910308B2Publication Date: 2021-02-02
- Inventor: John J. Pekarik , Anthony K. Stamper , Vibhor Jain
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent Anthony Canale; Andrew M. Calderon
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/525 ; H01L21/768 ; H01L23/00 ; H01L23/62
Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to dual thickness fuse structures and methods of manufacture. The structure includes a continuous wiring structure on a single wiring level and composed of conductive material having a fuse portion and a thicker wiring structure.
Information query
IPC分类:
