Invention Grant
- Patent Title: Semiconductor device having a resin case with a notch groove
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Application No.: US15445313Application Date: 2017-02-28
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Publication No.: US10910324B2Publication Date: 2021-02-02
- Inventor: Tatsuhiko Asai , Katsumi Taniguchi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP2016-056246 20160318
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/00 ; H01L21/48 ; H01L21/52 ; H01L23/049 ; H01L23/10
Abstract:
A semiconductor device has a configuration in which a stacked assembly and a resin case are combined. The stacked assembly includes a semiconductor element, a stacked substrate on which the semiconductor element is mounted, and a metal substrate on which the stacked substrate is mounted. In the resin case, a notch groove is provided at a corner portion for reducing a stress. At least one of a width and a length of the notch groove is 2 mm or more.
Public/Granted literature
- US20170271273A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2017-09-21
Information query
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