Invention Grant
- Patent Title: Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium
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Application No.: US16401760Application Date: 2019-05-02
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Publication No.: US10910334B2Publication Date: 2021-02-02
- Inventor: Takahisa Okuzono , Masaki Tomita , Jumpei Fujikata
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2018-092546 20180511
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/66 ; G06T7/00 ; G06K9/62
Abstract:
A device for inspecting a bump height includes an illumination device, an imaging device, and a control device. The illumination device irradiates a substrate with light. The substrate includes a resist and a bump formed on an opening portion of the resist. The imaging device images a pattern of the resist and the bump. The control device evaluates a height of the bump based on a luminance value of image data of the pattern obtained by the imaging device.
Information query
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