Invention Grant
- Patent Title: Flip chip bonding method
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Application No.: US16533450Application Date: 2019-08-06
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Publication No.: US10910339B2Publication Date: 2021-02-02
- Inventor: Hwail Jin , Yongwon Choi , Myung-Sung Kang , Yeongseok Kim , Wonkeun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2018-0096743 20180820
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/78
Abstract:
A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.
Public/Granted literature
- US20200058615A1 FLIP CHIP BONDING METHOD Public/Granted day:2020-02-20
Information query
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