Invention Grant
- Patent Title: Package structure with improvement layer and fabrication method thereof
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Application No.: US16393759Application Date: 2019-04-24
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Publication No.: US10910343B2Publication Date: 2021-02-02
- Inventor: Lei Shi
- Applicant: TONGFU MICROELECTRONICS CO., LTD.
- Applicant Address: CN Nantong
- Assignee: TONGFU MICROELECTRONICS CO., LTD.
- Current Assignee: TONGFU MICROELECTRONICS CO., LTD.
- Current Assignee Address: CN Nantong
- Agency: Anova Law Group, PLLC
- Priority: CN201810796944 20180719
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L21/78
Abstract:
The present disclosure provides a package structure and its packaging method. The packaging method includes: providing a bonding layer on a substrate; forming an improvement layer on the bonding layer, where the improvement layer has openings, and bottoms of the openings expose a surface of the bonding layer; providing chips, each including a non-functional surface; and mounting the chips by attaching the non-functional surface to the bonding layer at the bottoms of the openings.
Public/Granted literature
- US20200027859A1 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2020-01-23
Information query
IPC分类:
