Invention Grant
- Patent Title: Integrated assemblies having capacitive units, and having resistive structures coupled with the capacitive units
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Application No.: US16262087Application Date: 2019-01-30
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Publication No.: US10910358B2Publication Date: 2021-02-02
- Inventor: Satoru Sugimoto , Hiroki Hosaka , Hayato Oishi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L29/92
- IPC: H01L29/92 ; H01L29/86 ; H01L23/50 ; H01L27/01 ; H01L23/522 ; H01L27/06
Abstract:
Some embodiments include an integrated assembly having a capacitive unit which includes a plurality of capacitive subunits. A first conductive structure is under a first group of the capacitive subunits and is coupled with them. A second conductive structure is under a second group of the capacitive subunits and is coupled with them. A third conductive structure is over the capacitive subunits and is coupled with all of the capacitive subunits. A resistive structure extends under the first and second conductive structures. The resistive structure has a first-end-region under the first conductive structure and coupled with the first conductive structure. The resistive structure includes resistive lines extending from the first-end-region to second-end-regions.
Public/Granted literature
Information query
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