Invention Grant
- Patent Title: Semiconductor switching device separate by device isolation
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Application No.: US16983767Application Date: 2020-08-03
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Publication No.: US10910420B2Publication Date: 2021-02-02
- Inventor: Min-Feng Kao , Dun-Nian Yaung , Jen-Cheng Liu , Tzu-Hsuan Hsu , Szu-Ying Chen , Wei-Cheng Hsu , Hsiao-Hui Tseng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/18

Abstract:
A device including a gate structure formed over a semiconductor substrate, the gate structure having extensions, a device isolation structure formed into the semiconductor substrate adjacent the gate structure, wherein the extensions are over a portion of the device isolation structure, and source/drain regions on both sides of the gate structure, the source/drain regions being formed in a gap in the device isolation structure and being partially enclosed by the extensions of the gate structure.
Information query
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