Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method thereof, and electronic device
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Application No.: US16934792Application Date: 2020-07-21
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Publication No.: US10910423B2Publication Date: 2021-02-02
- Inventor: Yuka Nakamoto , Yukihiro Sayama , Nobuyuki Ohba , Sintaro Nakajiki
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2015-209550 20151026
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/14

Abstract:
The present technology relates to a solid-state imaging device, a manufacturing method, and an electronic device, which can improve sensitivity while improving color mixing. The solid-state imaging device includes a first wall provided between a pixel and a pixel arranged two-dimensionally to isolate the pixels, in which the first wall includes at least two layers including a light shielding film of a lowermost layer and a low refractive index film of which refractive index is lower than the light shielding film. The present technology can be applied to, for example, a solid-state imaging device, an electronic device having an imaging function, and the like.
Public/Granted literature
- US20200350352A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE Public/Granted day:2020-11-05
Information query
IPC分类: